Influence of Patterns on Mechanical Properties of Ultrasonically Welded Joints in Copper Substrate and Wire

Abstract Ultrasonic wire welding is considered a method of choice for creating reliable interconnects in electronics industry including aerospace, batteries and electric vehicles. In this paper, ultrasonic welding tests between EVR252 copper wire and substrate are carried out. Novel pattern morphologies are machined on substrates to explore its influence on mechanical properties of welded joint. […]

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